Press Releases

Seattle, Wash., November 24, 2014 – ATREG, Inc., a leading advisor in the disposition and acquisition of infrastructure-rich advanced technology manufacturing assets, announced today that senior vice president and principal Barnett Silver will present at the third edition of SEMI Europe’s 2015 European 3D TSV Summit to be held January 19-21 in Grenoble, France. On Monday, January 19 at 5:00 pm, Silver will open the event’s Market Briefing session by presenting The Future of Assembly and Test: Convergence or Coexistence? The importance of the $50 billion assembly and test market is going to come into sharp focus as the semiconductor industry continues to mature and new packaging technologies may help companies drive revenue and maintain margins.

Early on, fully integrated semiconductor companies built tools, designed and manufactured chips, and packaged those chips for sale. As the industry evolved, new business models have emerged leading to a disaggregated ecosystem comprised of independent equipment companies, fabless design houses, foundries, and outsourced assembly and test (OSAT) companies.

ATREG, however, believes that the macroeconomic and technological forces impacting the whole industry will lead to continued consolidation among back-end companies as well as a re-integration of some front-end and back-end manufacturing activities through the convergence of the role of foundries and OSAT companies, related to new 3D packaging technologies. Cost pressures are already leading to further IDM outsourcing and consolidation among OSAT vendors. And while lower margins in the packaging space have historically been unattractive to foundries, OSAT companies have delivered high returns to shareholders over the past five years.

There are now signs that foundry companies are moving into the back-end space. Part of the reason for the change is economic, but it is also being driven by technology as advanced, wafer-level packaging techniques closely align with the capabilities of foundries. In his presentation, Silver will explore how these forces will manifest themselves over the next several years.

Themed Enabling Smarter Systems, the 2015 European 3D TSV Summit will bring together all the major players involved in the full 3D supply chain and semiconductor advanced packaging sector. The forum will touch on the latest product developments, achievements, and industry issues, including cost, business models, supply chain, manufacturability, and technology. The last edition of the event in January 2014 attracted more than 320 people from over 20 countries.

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ATREG is the only firm that advises companies in the complex disposition and acquisition of infrastructure-rich advanced technology manufacturing assets around the world. Our unique blend of market knowledge, industry relationships, and transaction expertise help inform strategic client decisions and achieve the best possible outcomes. Since its inception in 2000, ATREG has been retained by some of the world’s most reputable corporations, including Applied Materials, Atmel, Freescale, Fujitsu, GLOBALFOUNDRIES, IBM, Infineon, Intel, LG, LSI, Maxim, Micron, NXP, ON Semiconductor, Panasonic, Qualcomm, Renesas, Safran, Sony, Spansion, SUMCO, Texas Instruments, and Western Digital. ATREG is headquartered in Seattle, USA. For more information, please visit us online at www.atreg.com.

SEMI is the global industry association serving the nano-and micro-electronic manufacturing supply chains. Our 1,900 member companies are the engine of the future, enabling smarter, faster, and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets, and meet common industry challenges. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, please visit us online atwww.semi.org. To learn more about the 2015 European 3D TSV Summit, please go to http://www.semi.org/eu/node/8566.