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SEMI: Global 300mm fab equipment spending expected to reach record $400 billion by 2027

300mm wafer

In its latest Quarterly 300mm Fab Outlook released on September 26th, SEMI reported that global spending on 300mm fab equipment is expected to reach a record $400 billion from 2025 to 2027. The regionalization of semiconductor fabs and the increasing demand for artificial intelligence (AI) chips used in data centers and edge devices are driving this rise in funding.

Global 300mm fab equipment spending is forecast to increase by 4% to $99.3 billion in 2024 and further rise by 24% to $123.2 billion in 2025. Spending is forecast to experience 11% growth to $136.2 billion in 2026 followed by a 3% increase to $140.8 billion in 2027.

Here are a few regional highlights from the report:

  • China will maintain its position as the top spending region on 300mm equipment globally until 2027, investing over $100 billion in the next three years driven by its national self-sufficiency policies.
  • Korea is projected to rank second and invest $81 billion in the next three years to further its dominance in memory segments.
  • Taiwan is forecast to spend $75 billion on 300mm equipment over the next three years, ranking third as the region’s chipmakers build some new fabs overseas.
  • The Americas is projected to invest $63 billion from 2025 to 2027.
  • Japan, Europe, the Mideast, and SE Asia are expected to spend $32 billion, $27 billion, and $13 billion respectively from 2025 to 2027.

Click here to read the full SEMI press release for more details.