In its latest 300mm Fab Outlook published early October, SEMI reported that global 300mm fab equipment spending is expected to total $374 billion from 2026 to 2028. This robust investment reflects fab regionalization and surging artificial intelligence (AI) chip demand for data centers and edge devices, while underscoring the growing commitment to semiconductor self-sufficiency across key regions through localized industrial ecosystems and supply chain restructuring.
Global 300mm fab equipment spending is expected to exceed $100 billion for the first time in 2025, growing by 7% to $107 billion. The report forecasts investment will increase by 9% to $116 billion in 2026, by 4% to $120 billion in 2027, and by 15% to $138 billion in 2028. Here are some regional growth highlights for the three-year period 2016-2018:
- China – Expected to continue to lead in 300mm equipment spending with $94 billion in projected investments.
- Korea – Projected to rank second in global 300mm equipment spending with $86 billion invested.
- Taiwan – Expected to invest $75 billion in 300mm equipment, ranking third, primarily on 2nm and sub-2nm capacity.
- Americas – Projected to invest $60 billion, rising to fourth position, with U.S. suppliers expanding advanced process capacity to meet surging AI application demands.
- Japan, EMEA & SEA – Expected to invest $32 billion, $14 billion, and $12 billion, respectively, with policy incentives expected to raise equipment investment by +60% by 2028 compared to 2024.
Click here to read SEMI’s full press release.