Q1 2015

Wafer tray


ATREG is pleased to offer for purchase a production-ready, state-of-the-art cleanroom located in Singapore. This facility consists of a fabrication plant, a warehouse, an office, and a central utility building totaling 27,000 m2 (290,625 sq. ft.) with 66,000 m2 (710,418 sq. ft.) of excess adjacent land available for future expansion. With its robust infrastructure, this facility can accommodate the needs of multiple advanced technology sectors requiring a critical environment.

State-of-the-art cleanroom, Singapore

Opportunity benefits

  • State-of-the-art facility: This is a pristine automated cleanroom with robust infrastructure built in 2008
  • Adaptability: This facility can be adapted to support the production of a variety of advanced technology devices
  • Expansion potential: The buyer has the ability to expand their footprint on the land adjacent to the facility
  • Price: This is a unique opportunity to acquire a facility at a price below its replacement value
  • Location: This is a stable and cost-effective manufacturing region with a strong electronics supply chain / ecosystem and secure IP environment

Site specifications 

  • Site: 93,000 m2 (1,001,043 sq. ft.) campus situated within one of Singapore’s technology parks (subject to leasehold agreement)
  • Cleanroom: Three-floor building with approximately 14,500 m2 (156,076 sq. ft.) of production space, including 4,500 m2 (48,437 sq. ft.) of cleanroom area (Class: ISO 4,5,6,7)
  • Warehouse: 2,000 m2 (21,527 sq. ft.) total surface, 8.6 m full clearance, two loading & two unloading areas, two links to the production area
  • Office / Administration: Five-floor building, 4,600 m2 (49,513 sq. ft.) of office space, and a link to the cleanroom area on the second floor/
  • Infrastructure: DI water, waste water treatment, bulk and generated gas, exhaust, cooling, and back-up generators

We invite interested parties to email us to learn more about this offering.





We are pleased to announce that ATREG will be presenting at the upcoming China Semiconductor Technology International Conference (CSTIC) held in conjunction with SEMICON China at the Shanghai International Convention Center. On Monday, March 16, Vice President of Business Intelligence Eric Larsen will present The Future of Assembly & Test: Convergence or Coexistence? during Session III (3D and SiP Packaging) of Symposium VII on Packaging & Assembly.

The importance of the $50 billion assembly & test market is going to come into sharp focus as the semiconductor industry continues to mature and new packaging technologies may help companies drive revenue and maintain margins. Early on, fully integrated semiconductor companies built tools, designed and manufactured chips, and packaged those chips for sale. As the industry evolved, new business models have emerged leading to a disaggregated ecosystem comprised of independent equipment companies, fabless design houses, foundries, and outsourced assembly & test (OSAT) companies. ATREG, however, believes that the macroeconomic and technological forces impacting the whole industry will lead to continued consolidation among back-end companies as well as a re-integration of some front-end and back-end manufacturing activities through the convergence of the role of foundries and OSAT companies, related to new 3D packaging technologies. Cost pressures are already leading to further IDM outsourcing and consolidation among OSAT vendors. And while lower margins in the packaging space have historically been unattractive to foundries, OSAT companies have delivered high returns to shareholders over the past five years. There are now signs that foundry companies are moving into the back-end space. Part of the reason for the change is economic, but it is also being driven by technology as advanced, wafer-level packaging techniques closely align with the capabilities of foundries. In this presentation, Larsen explores how these forces will manifest themselves over the next several years. Email us to request a copy of our presentation.