Newsletters

Q3 2012

Printed circuit board

THE FUTURE OF SEMICONDUCTOR MANUFACTURING Back in July, I had the honor to speak at GSA’s CEO Roundtable in Taiwan regarding the future of semiconductor manufacturing, a topic on the minds of many industry executives given the challenges presented by slowing growth, accelerating costs, and constant pricing pressure that results in margin compression throughout the

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Q2 2012

Former IDT Hillsboro fab

REVAMPING JAPAN’S IC MANUFACTURING STRATEGY I have had the chance to spend a significant amount of time in Japan over the past few months and experience first-hand many of the wonderful things this country has to offer. A long-standing electronics leader, Japan has been a major force in the semiconductor sector for decades and remains

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Q1 2012

Silicon wafers

MARKET OBSERVATIONS AND INSIGHTS FOR 2012 Momentum from the 2010 semiconductor market rebound carried into Q1 2011, but quickly dissipated as devastating natural disasters took their toll on the industry, not to mention the countless lives of people in Japan and Thailand. This, combined with a general economic malaise stemming from concerns about sovereign debt,

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Q3 2011

Electronic components

FABLESS TO FAB-LITE: AN EMERGING TREND?  Each year brings new challenges and opportunities for the global semiconductor industry. What remains constant though is a company’s need to produce the right product, in the right quantity, on time, and at a competitive price.  As semiconductor companies encounter supply chain disruptions, IP breaches, currency fluctuations, and market

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Q2 2011

Chips

ARE FAB INVESTMENTS IN MATURE MANUFACTURING REGIONS MAKING A COMEBACK? 2011 is off to an active start for the semiconductor industry with several notable M&A and fab transactions announced or completed so far this year: In January, ON Semiconductor completed its strategic acquisition of SANYO Semiconductor from SANYO Electric to gain access to the Japanese

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